SW Series - Automatic Wafer Baking Machine Cutting Chart
Swift Wafer Machine
SW : Wafer Baking Plants Plate Size : 460x290
Details 1st Cut 2nd Cut
Wafer Die Size ( in mm)* 460 290
Trimmings the book 5 5
Size available for cutting 455 285
Resultanat Size**+/- 1mm mm Cuts mm
227.5 2 142.5
151.7 3 95.0
113.8 4 71.3
91.0 5 57.0
75.8 6 47.5
65.0 7 40.5
56.9 8 35.6
50.6 9 31.7
45.5 10 28.5
41.4 11 25.9
37.9 12 23.8
35.8 13 21.9
32.5 14 20.4
30.3 15 19.0
28.4 16 17.8
26.8 17 16.8
25.3 18 15.8
23.9 19 15.0
22.8 20 14.3
Note:
  1. ***Deduct -1mm to accomodate for the cutting wire waste
  2. *There may be shrinkage first , and expansion of wafer sheet on storage(1%)
  3. The 1st Cut =Face of 460 Entry : 2nd Cut =Face of 290 Entry
  4. Incase of Reversal of Cutting Parameters, Changes in the machine table Cover & Pusher with attachments have to be done.
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