WA-Wafer Biscuit Cutting Chart
Mixing machine for wafer & cone batters
WA : Wafer Baking Plants Plate Size : 460x290
No. Chart for making a cut selection of wafers. 1st Cut 2nd Cut
Wafer Die Size ( in mm)* 470 350
Minimum Trimmings the book (1.5mm per side) 5 5
Size available for cutting 465 345
Resultanat Size***+/- 1mm mm Cuts mm
232.5 2 172.5
155.0 3 115.0
116.3 4 86.3
93.0 5 68.0
77.5 6 57.5
66.4 7 49.3
58.1 8 43.1
51.7 9 38.3
46.5 10 34.5
42.3 11 31.4
38.8 12 28.8
35.8 13 26.5
33.2 14 24.6
31.0 15 23.0
29.1 16 29.1
27.4 17 20.3
Note:
  1. ***Deduct -1mm to accomodate for the cutting wire waste
  2. *There may be shrinkage first , and expansion of wafer sheet on storage(1%)
  3. The 1st Cut =Face of 470 Entry : 2nd Cut =Face of 350 Entry
  4. Incase of Reversal of Cutting Parameters, Changes in the machine table Cover & Pusher with attachments have to be done.
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