1.0 Initial Set Up & Unpacking
1.1 The baking plates are coated with a "gel" for shipment, kindly clean it with
a clean dry cloth before heating.
1.2 While using the machine for the first time allow the plate to heat
NOTE: With new baking plates and whenever the plates have been cleaned they must be
greased well with bees wax or hard fat before regular baking .Then bake for the
first time at reduced heat and reduced batter quantity; increase the batter quantity and
heat till you can have proper wafer sheets, which release easily with out breaking or
sticking to the plates. Remove the wafer sheets with a wooden spatula or with a brass wire
brush. If baking is done properly a glaze will from on the surface of the tongs which
ensures the easy release of the wafer sheets
2.0 ELECTRICAL CONNECTION
2.1 240 volts, single phase, 50Hz,1.5KW/element; Total 2.5KW.
2.2 There are two heating elements in each baking tongs.
2.3 Earthing is absolutely essential for safe working.
3.0 BAKING PROCEDURE
3.1. It takes about 20 minutes for the plates to heat initially.
NOTE:- Batter composition, thickness of wafer and baking temperature determines the baking
3.2 When the desired temperature is reached set the thermotrol setting of the control box
to 70 to 80 setting.
3.3 Thermotrol regulates the time for which the power is to be supplied to the heating
3.4 Dip the dosimeter cups in the batter tank and put it on the bracket provided for in
3.5 The excess batter drains off leaving the desired quantity.
3.6 The quality can be adjusted by means of a screw provided near the lever and the handle
it raises or lower the sliding lever; this in turn, reduces or maintains the quantity the
remains in the cups.
3.7 Test if the correct baking temperature is reaches with a trial a small quantity of
batter is poured an to the plates.
4.0 Advice on Maintenance & Precautions
4.1 Burnt sugar & fat particles leave a brown crust on the surface of the baking plate
when the machine has been in use for a longer time. These burnt remnants have to be
removed from time to time with a normal brass wire brush.
In case it is not done regularly, the carbon build up will
retard the baking period.
4.2 Never use a wet cloth for cleaning the plates.
4.3 Operational Precaution
4.3.1.Never leave the machine in "On" position unattended.
4.3.2.Always brief the operator on the standard procedures
4.3.3.Use the side handle only to lower and raise the UPPER tong.
4.3.4.In case after the batter is deposited on the plate the lock does not operate to
close it in the first instance DO NOT try to use force to close the tong.
4.3.5.In case any spare part is used in the machine, please ask for additional spare to
ensure continuity in operation.
5.0 Batter Recipe
5.1 It is up to the user of the machine to find out the most
favorable batter recipe, since customer's taste with regards to colour, taste and
hardness of wafers, differ from place to place.
5.2 See Annexure for a sample Wafer Batter recipe.
Adjustment For Wafer Sheets
Checking thickness of the wafer sheets of even thickness.
In order to check the thickness of the wafer sheet collect the produce of each wafer tongs separately then measure the sheets
one by one with a thickness gauge/or an accurate verities; on all
four corners and in the middle and make a note of actual differences.
The thickness of the wafer sheet can be adjusted by means of the fastening bolts of the
• First loosen all bolts (M10), not the four threaded bushings (M20).
• Turn the treaded bushings on the corner that need to be adjusted either clockwise (=thinner) or counter clockwise (=thicker) 1/6th of a turn equals to 0.2 mm; full turn 1.25mm.
• After adjustment tighten the bolts (M10) on the four corner again. Then again tighten the remaining threaded bushings care-fully until they touch the plates and lock with the bolts.
• Any such adjustment has to be done with utmost care, other-wise the baking plates may get bent and warped.
• After adjustment another trial round of wafer sheets has to be produced and measured again.
• Place four metal strips or shims of the desired thickness of wafer (minus the engraving thickness) on the baking plates.
• Then all set bolts of the upper plate as well as the adjusting bushings are loosened so that they no longer rust on the upper plate.
• The pressure screw (M20) is screwed as far down as possible by hand against the plate.
• Then screw down all fastening bolts (M10) of the plates. Tighten by spanner first the fastening bolts, then the adjusting bushings.
• Open the plate and remove the strips/shims.
Note: If it becomes evident in
production that the wafer thick-ness has a slight deviation each wafer sheet must be
measured. Any deviation can be re-adjusted.
It may be necessary to adjust the locking handle pressure after any such adjustments
SHEET / ICE CREAM CONE BATTER
Bicarbonate and Ammonium Bicarbonate (3:1)
1. Put the water in a "TM" Series Mixer.
2. Add 5, 6 & 8
3. Start the mixer, add the starch and then slowly add
a small quantity of flour at a time.
4. After the wheat flour is fully mixed add the
fat and lecithin emulsion (preferably pre-warmed )
5. Mix for a couple of minutes (approx. 3-4 minutes)
6. Strain through a sieve wire mesh to remove lumps.
7. The ready mix will KEEP good for about 2-3 hours,
so just prepare sufficient quantity.
Notes on batter dough preparation:
The wafer quality depends on the accuracy of the
dough, particularly as far as weighing and mixing are
concerned. In the course of the whole mixing process,
the consistency changes due to material dissolving and
swelling processes, gluten development and reactions
with other raw material, including air. When a certain
consistency is reached, the mixing process is
finished, particularly when a uniform mixing of all
ingredients allows for a smooth flow of the dough on
the baking plates/cone baking dies.
We recommend to leave the dough for 5 minutes, and to
pass it through a sieve afterwards in order to hold
back the particles, which have not dissolved
completely. The dough will swell again. If flour with
higher level of coarsely ground grain is used, the
dough should be left for about 10 minutes. The longer
the dough can rest, the better will be its flow. This
is referred to as natural slackening of the dough.
After the optimum recipe has been found out, it should
be modified by the master baker, only after previous
Mixing of the dough:
For beating the wafer dough, High Speed Mixers are
best suited. Depending on the type of machine and the
charge volume, the mixing period is between 3 and 10
minutes. Sufficient beating is also important for a
gleaming surface of the wafer sheet without any pores.
For the type of mixing procedure, different
requirements have to be met.
All components, including water are portioned directly
into the mixer.
First, mix the whole dry matter with about half of the
liquid. Add the remaining liquid afterwards at your
own discretion, until the suspension shows adequate
All raw material and additives except the flour are
beaten together with the remaining amount of liquid,
until they are mixed thoroughly. After that, the flour
is mixed in together with the remaining liquid.
The dough should have a temperature of 20-25°C.
while being prepared warmer dough tends to turn sour
due to the addition of soda, if it is stored
intermediately. The temperature of the pouring wafer
is adjusted according to the temperature of the flour
and the mixer.
Material processes during mixing:
The important process during mixing is dissolving and
swelling of the flour components. This is decisive for
the quality of the baking process and the wafer sheet
and for the energy demand during baking, the water
added during dough preparation has to be vaporized
again during baking.
Important advice for the preparation of the wafer
Use smooth wheat flour with medium content of gluten.
Depending on the quality of the flour, the amount of
water should be increased or decreased, as every type
of flour has different soaking characteristics.
In order to get a wafer sheet of good quality, the
batter should not be too dilute.
Preparation of the oil/fat - lecithin emulsion:
Oil / Fat should be heated lukewarm. Lecithin should
be added slowly and stirred until it dissolves
completely. The quality of the emulsion should
correspond to the batter recipe used. Then it is
poured into the readily prepared wafer batter and