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Wafer Cutting Machine - (WC):-

 

 

Wafer Cutting Machine

 

 

 

 

 

 

Automatic Wafer Cutting Machine (WC)

R&D Engineers manufactures a series of cutting machines, WC machine can handle different sizes of wafer sheets (230 mm x 290 mm, ......). These are fully automatic machines for cutting flat and Hollow wafers filled with cream. In the cutting operation the wafer book are first pushed through one set of cutters and then at a right angle (perpendicular) through a second set of cutters. Fixed and tensioned cutting wires in removable frames are used. Changeover to other cutting sizes is facilitated by quickly and easily changing the cutting frames and pushers. These machines are designed for high-capacity plants. They occupy less space.



 

Technical Data :

 

Machine Variables WC1 WC2 WC5
Size of plate (in mm. apprx) 270X370 290X460 350X470
Stack height (in mm) 10 to 70 10 to 70 10 to 70
Minimum cutting width 16  16  16 
Cutting Wire (Spring Steel)(in mm) 0.5 0.5 0.5
Connected Load (in Kw) 1.5 1.5 1.5
Dimensions (in mm)
Length 1700 1700 1700
Width 940 940 940
Height 1150 1150 1150
1150Net Weight (in kgs. apprx) 650 650 650
Ship650ping Volume (CBM) 2 2 2

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

S.No. Wafer Biscuit Cutting Size
1. Size of Wafer 230X290
2. Size of Wafer 290X460

 

 

 

 

 

Aditional Link:

 

Download Brochure Pdf File 96 KB

 

 

 

 

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We are the first Indian manufacturers of baking machines for Wafer Biscuits, Ice Cream Cones and Rolled Sugar Cones.
Established in 1991, R&D Engineers is India’s foremost manufacturer of baking machines for Wafer Biscuits, Ice Cream Cones and Rolled Sugar Cones.
We are located in Hyderabad India.