sitemap youtube  viadeo 
  We are the first Indian manufacturers of baking machines for Wafer Biscuits, Ice Cream Cones and Rolled Sugar Cones.
Established in 1991, R&D Engineers is India’s foremost manufacturer of baking machines for Wafer Biscuits, Ice Cream Cones and Rolled Sugar Cones. We are located in Hyderabad India.
 
 

Wafer Cutting Apparatus - (WCM):-


 

Wafer Cutting Apparatus

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

The wire cutting machine "WCM" is manually operated and cuts wafer blocks to small wafer fingers of predetermined dimensions. The cutter frame and feed bar can be exchanged to produce other size of biscuits. The machine is used for cutting of small scale output.

 

Machine Variables WCM
Size of the Wafer sheet (in mm apprx) 275 X 375
Dimensions (approx)
Length 1450
Width 1130
Height 675
Weight (approx)  
Net 130
Gross 200
Shipping Volume(CBM) 1.2  

 

 

 

 

 

 

 

 

 

 

 

 

 

 

S.No. Wafer Biscuit Cutting Size
1. Size of Wafer 270X370

 

 

 

 

 

 

Note
We are constantly guided by our principle of offering our customers better and better machines; to give increased efficiency and higher levels of automation. The technical data and illustrations are subject to change without notice

Aditional Link:

Download Brochure Pdf File 267 Kb