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  We are the first Indian manufacturers of baking machines for Wafer Biscuits, Ice Cream Cones and Rolled Sugar Cones.
Established in 1991, R&D Engineers is India’s foremost manufacturer of baking machines for Wafer Biscuits, Ice Cream Cones and Rolled Sugar Cones. We are located in Hyderabad India.
 
 

Wafer Cutting Apparatus - (WCM):-


 

Wafer Cutting Apparatus

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

The wire cutting machine "WCM" is manually operated and cuts wafer blocks to small wafer fingers of predetermined dimensions. The cutter frame and feed bar can be exchanged to produce other size of biscuits. The machine is used for cutting of small scale output.

 

Technical Details WCM
Plate Size in mm 270 X 3750
Out put wafer sheets.hr Stack Height (mm) 10 to 70
Electric Heating: Connected load in KW Min. Cutting Wisth 16
Cream Filled wafers.Hour** (Kgs appx.) Cutting Wire Spring Steel in mm 0.5
Dimensions (approx.in mm)  
Length 1450
Width 1130
Height 675
Weight (approx) 110
Net 130
Gross 200
Shipping Volume(CBM) 1.0

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

S.No. Wafer Biscuit Cutting Size
1. Size of Wafer 270X370

 

 

 

 

 

 

Note
We are constantly guided by our principle of offering our customers better and better machines; to give increased efficiency and higher levels of automation. The technical data and illustrations are subject to change without notice

Aditional Link:

Download Brochure Pdf File 267 Kb