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  We are the first Indian manufacturers of baking machines for Wafer Biscuits, Ice Cream Cones and Rolled Sugar Cones.
Established in 1991, R&D Engineers is India’s foremost manufacturer of baking machines for Wafer Biscuits, Ice Cream Cones and Rolled Sugar Cones. We are located in Hyderabad India.
 
     
Manual wafer biscuits production plants

Wafer Machine - ' WT' Manual Wafer Baking Machine :-

 

 

Introduction

WT Series cream wafer plants are used for the manually operated production of cream wafer biscuits. They are characterized by simple mechanism study and flexibility. These machines are low cost and economical in operation. Depending on the output required they can be supplied with 6, 9 or 12 Wafer baking tongs. Cream spreading table, cutting machine, batter and cream mixer and packing machine ensure that production is continuous. 

Batter Preparation  A mixer of wheat flour, maize starch, vegetable fat and preservative colours is churned into a paste in the batter mixer.

Machine Operation (6 WT) 

The batter is fed to a pre-heated wafer tong by a special dosing device. Baking takes 1-3** minutes. The baked sheets are cooled. Subsequent operations are creaming, sandwiching & cutting. The cut wafers are then ready to be packed.

 

WT 1 Special

WT 1 Standard
 
 

Technical Specifications

Output details

Wafer Biscuit Cutting Chart

Instant Quote

FAQs

Recipes

 

 

Process Chart

 

 
 

Supporting Equipment

 

1. Wafer Tong  2. Batter Mixer  3. Cream Mixer  4. Cream Spreading App. 5. Wafer Cutting M/C  6. Packing Machine 
 
 


Technical Specifications

Technical / Output Details 'WT'
Wafer Baking Machine - WT2737:


This chart details 6 wafer tong station

'WT' Manual wafer plant WT1 WT3 WT6
Plate Size in mm 270x370 270x370 270x370
Output of wafer sheets / Hr 30* 90 * 240 *
Electric Heating :
Connected load in KW 2.5 7.5 15
Current Consumption in KW / Hr 2.0 6 12
Cream filled wafers / Hour ** (Kgs app.)  4 10  20 - 25 
Dimensions (approx. in mm):
Shipping Data 1 Tong X 1 1 Station X 3 3 Station X 2
Length  750 mm 1420 1420 X 2
Width  440 mm 440 X 1 440 X 2
Height  300 mm 750 X 1 750 X 2
Net Weight  80 320 640
Weight incl. sea worthy packing  (appx.) 150 500 900
Shipping space in M3  1.0 1.5 2.0
 
  Working Instructions

1.0 Initial Set Up and Unpacking
1.1 The baking plates are coated with a "gel" for shipment. Kindly clean it with a clean dry cloth before heating.
1.2 While using the machine for the first time allow the plate to heat slowly. See notes below.


Note: With new baking plates and whenever the plates have been cleaned they must be greased well with bees wax or hard fat before regular  baking. Then bake for the first time at reduced heat and reduced batter quantity. Increase the batter quantity and heat till you can have proper wafer sheets which release easily without breaking or sticking to the plates. Remove the wafer sheets with a wooden spatula or with a brass wire brush. If baking is done properly a glaze will form on the surface of the tongs which ensures the easy release of the wafer sheets

2.0 Electrical Connection
2.1 240 volts, single phase, 50Hz,1,5KW/element. Total 2.5 KW.
2.2 There are two heating elements in each baking tongs.
2.3 Earthing is absolutely essential for safe working.
3.0 Baking Procedure
3.1. It takes about 20 minutes for the plates to heat initially.

Note:
Batter composition, thickness of wafer and baking temperature determines the baking time.


3.2 When the desired temperature is reached set the thermotrol setting of the control box to 70 to 80.
3.3 Thermotrol regulates the time for which the power is to be supplied to the heating element.
3.4 Dip the dosimeter cups in the batter tank and put it on the bracket provided for in the tank.
3.5 The excess batter drains off leaving the desired quantity.
3.6 The quality can be adjusted by means of a screw provided near the lever. The handle raises or lowers the sliding lever which in turn reduces or maintains the quantity the remains in the cups.
3.7 Test if the correct baking temperature is reaches with a trial a small quantity of batter is poured an to the plates.

4.0 Advice on Maintenance & Precautions
4.1 Burnt sugar and fat particles leave a brown crust on the surface of the baking plate when the machine has been in use for a long time. These burnt remnants have to be removed  with a normal brass wire brush. In case it is not done regularly, the carbon build up will retard the baking period.
4.2 Never use a wet cloth for cleaning the plates.
4.3 Operational Precaution

4.3.1.Never leave the machine in an "On" position unattended.
4.3.2.Always brief the operator on the standard procedures
4.3.3.Use the side handle only to lower and raise the UPPER tong.
4.3.4.In case after the batter is deposited on the plate the lock does not operate to close it in the first instance DO NOT try to use force to close the tong.
4.3.5.In case any spare part is used in the machine, please ask for additional spare to ensure continuity in operation.
5.0 Batter Recipe

5.1 It is up to the user of the machine to find out the most favorable batter recipe, since customer's taste  with regards to colour, taste and hardness of wafers, differ from place to place.
5.2 See Annexure for a sample Wafer Batter recipe.


Adjustment For Wafer Sheets

Check the thickness of the wafer sheets for even thickness. In order to check the thickness of the wafer sheet collect the produce of each wafer tongs separately then measure the sheets one by one with a thickness gauge/or an accurate verities on all four corners and in the middle and make a note of actual differences.

Method A

The thickness of the wafer sheet can be adjusted by means of the fastening bolts of the baking plates.

 

First loosen all bolts (M10) [not the four threaded bushings (M20).]

 

Turn the treaded bushings on the corner that needs to be adjusted either clockwise (=thinner) or counter clockwise (=thicker). 1/6th of a turn equals to 0.2 mm and a full turn equals to 1.25mm.

 

After adjustment tighten the bolts (M10) on all four corners again. Then tighten the remaining threaded bushings carefully until they touch the plates and lock with the bolts.

 

Any such adjustment has to be done with utmost care otherwise the baking plates may get bent and warped.

 

After adjustment another trial round of wafer sheets has to be produced and measured again.

 

Method B

 

Place four metal strips or shims of the desired thickness of wafer (minus the engraving thickness) on the baking plates

 

Then all set bolts of the upper plate as well as the adjusting bushings are loosened so that they no longer rust on the upper plate.

 

The pressure screw (M20) is screwed as far down as possible by hand against the plate.

Then screw down all fastening bolts (M10) of the plates. Tighten by spanner first the fastening bolts, then the adjusting bushings.

Open the plate and remove the strips/shims.

 

*Note : If it becomes evident in production that the wafer thickness has a slight deviation each wafer sheet must be measured. Any deviation can be readjusted.

Note : It may be necessary to adjust the locking handle pressure after any such adjustments