Automatic
Wafer Cutting Machine (WC)
R&D Engineers manufactures a series of cutting machines, WC machine can handle different sizes of wafer sheets (230 mm x 290 mm, ......). These are fully automatic machines for cutting flat and Hollow wafers filled with cream. In the cutting operation the wafer book are first pushed through one set of cutters and then at a right angle (perpendicular) through a second set of cutters. Fixed and tensioned cutting wires in removable frames are used. Changeover to other cutting sizes is facilitated by quickly and easily changing the cutting frames and pushers. These machines are designed for high-capacity plants. They occupy less space.
Technical
Data :
| Machine Variables |
WC1 |
WC2 |
WC5 |
| Size of plate (in
mm. apprx) |
270X370 |
290X460 |
350X470 |
| Stack height (in mm) |
10 to
70 |
10 to
70 |
10 to
70 |
| Minimum cutting
width |
16 |
16 |
16 |
| Cutting Wire (Spring
Steel)(in mm) |
0.5 |
0.5 |
0.5 |
| Connected Load (in
Kw) |
1.5 |
1.5 |
1.5 |
| Dimensions (in mm) |
| Length |
1700 |
1700 |
1700 |
| Width |
940 |
940 |
940 |
| Height |
1150 |
1150 |
1150 |
| 1150Net Weight (in
kgs. apprx) |
650 |
650 |
650 |
| Ship650ping Volume (CBM) |
2 |
2 |
2 |
|
