We are proud to introduce our Smart Grid Patterned Wafer Technology, developed to create an innovative wafer biscuit with a soft, indulgent chocolate-filled centre.

Our team has been experimenting with a unique smart grid wafer structure designed to securely hold chocolate paste while delivering an exceptional soft-centre bite and enjoyable eating experience.

The technology was proudly showcased at SIGEP in January 2025, where it received wide appreciation and encouraging feedback from industry professionals.
Following this success, a pilot project was launched in India to test and demonstrate the technology under the challenging conditions of a tropical climate.

We are delighted to share that the results have surpassed our expectations, demonstrating the potential of this technology for new-generation wafer products.

We are pleased to share this technological breakthrough with our friends, partners, and the R&D family worldwide.