R&D Engineers -Wafer Biscuits Machine

No. Chart for making a cut selection of wafers.	1st Cut		2nd Cut
Wafer Die Size ( in mm)*	470		350
Minimum Trimmings the book (1.5mm per side)	5		5
Size available for cutting	465		345
Resultanat Size***+/- 1mm	mm	Cuts	mm
	232.5	2	172.5
	155.0	3	115.0
	116.3	4	86.3
	93.0	5	68.0
	77.5	6	57.5
	66.4	7	49.3
	58.1	8	43.1
	51.7	9	38.3
	46.5	10	34.5
	42.3	11	31.4
	38.8	12	28.8
	35.8	13	26.5
	33.2	14	24.6
	31.0	15	23.0
	29.1	16	29.1
	27.4	17	20.3

Note:

***Deduct -1mm to accomodate for the cutting wire waste
*There may be shrinkage first , and expansion of wafer sheet on storage(1%)
The 1st Cut =Face of 470 Entry : 2nd Cut =Face of 350 Entry
Incase of Reversal of Cutting Parameters, Changes in the machine table Cover & Pusher with attachments have to be done.