The WA Series of Wafer Biscuit Baking Machine are designed for fully automatic production of wafer sheets with fine medium or deep-reeding, as well as wafer sheets with hollow forms for all types of shapes. According to the output required it may be equipped with 48, 60 and 72 baking plates. The standard plate size is 470 X 350. These baking machines can be heated by L.P.G. (or if preferred by Electricity). Universal triangular burners are used for baking effect in gas plant by using twin row method. This page details gas heated plants.

• Technical Specifications
• Wafer Biscuit Cutting Chart
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• Animation

FEATURES : FRAMELESS DESIGN / LOW FUEL CONSUMPTION

The machine features a sturdy and torsion resistant steel frame work. Non-corrosive protection is afforded to the heat losses, and heat transfers between inner and outer casings are reduced to be absolute minimum. The tong chain evolved is extremely strong and almost maintenance free.